Packaging Material Engineer (Senior)

RM3,500 - RM7,000 monthly
  • Integrated Device Technology (Malaysia) Sdn Bhd
  • Bayan Lepas Free Industrial Zone Phase 3, Bayan Lepas, Penang, Malaysia
  • Aug 06, 2019
Full time Photonics Engineers Mechatronics Engineers Manufacturing Engineering Technologists

Job Description

To further strengthen our Test Backend Team at Penang, we are looking for a Packaging Material Engineer to join our team!

Job Responsibilities:

  • Packaging material qualification and improvement.
  • Product Quality Improvement
  • Continue to drive Quality to achieve zero RMA.
  • RMA investigation.
  • New package setup, buy-off and qualification.

Preferred Skills & Knowledge:

  • Good knowledge and familiar with the requirement of all the packaging materials used in semiconductor manufacturing. The requirements inclusive the RoHS, materials, and design. E.g. for material are shipping tray & tube, end plug, carrier tape, cover tape, plastic reel, moisture barrier bag, carton box, wafer packaging materials
  • Able to read and update the engineering drawing with AutoCAD software.
  • Able to communicate with corporate NPI team and subcons on packaging materials for new project.
  • Able to work with supplier, subcon and internal IDT team to improve the quality issues related to packaging materials.
  • Able to work with purchasing team to achieve cost-saving goal.
  • Able to maintain and update internal system (SAP, Agile, IDT.com, etc) and document/spec for all the packaging materials.
  • Able to work with corp, subcon and internal IDT team on product marking (laser marking) related issues, including maintain and update internal system/document/spec.

Education and/or Experience:

  • A material science / chemical  Engineering bachelor's degree or equivalent training and 2 years’ experience in semiconductor.

Years of experience

3 - 5 years,   5 - 10 years  

Job Industry

Semiconductor  

Required Languages

English  

Do you accept foreigners

No